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> 无线通讯模组/Wireless Wifi Moulde> 3G模块

 

DTM618-W Module

• Chipset: Qualcomm MDM6270

• 60pin B2B, 45*30*2.9mm

• Operating Voltage: +3.8V typical

• GSM/EDGE: 900/1800MHz

UMTS/HSDPA: 2100MHz

• USB2.0, UART, GPIO, USIM, JTAG

• RIL/USB driver for Linux/Android/CE

 

General Specification

RF Antenna: GSC connector, 50ohm

Supply voltage: 3.3~4.2V, +3.8V typical

Current Consumption:

Sleep mode: about 3mA

Busy mode: about 520mA

 

Protocols

R5 with HSDPA (3.6 Mbps)

Improved power-saving mode

Air Interface

WCDMA(Rel99, HSDPA)

GSM(Rel99, GPRS, EDGE)

Data Rates

HSDPA : DL 3.6 Mbps/ UL 384 Kbps

 

Receive Specification

Frequency Band: GSM 900/1800MHz (2.43%)

Sensitivity: Below -109dBm

Frequency Band: HSDPA 2100MHz (0.1%)

Sensitivity: Below -109dBm

 

Transmit Specification

Frequency Band: GSM 900MHz

Nominal Power: 32.5dBm

Frequency Band: GSM 1800MHz

Nominal Power: 29.5dBm

Frequency Band: HSDPA 2100MHz

Nominal Power: 22.5dBm

 

Supported Services

• AT Command Sets

• Data Service

• SMS

Supporting formats of TEXT and PDU

 

Environmental

Operating Temperature: -30°C to +60°C

Storage Temperature : -30°C to +75°C



 

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